Evaluation of 1-D & 2-D models for thermal insulation thickness calculation in electronic packaging

The objective of this study is to evaluate the use of 1-D and 2-D compact heat transfer models for thermal design, optimization, and performance evaluation in electronic packaging. A model for heat spreading in orthotropic materials is developed. A resistance network analysis for calculation of heat transfer rate and junction temperatures has been carried out. A refrigeration cooled server package is used to illustrate the methodology. Heat transfer in the package components is modeled. Results of the analytical model and resistance network analysis are compared with a numerical solution. Capability of the analytical model in predicting the thermal field is discussed, and the effectiveness of using 1-D and 2-D models in thermal design and optimization of electronic packages is demonstrated.